Quick Verdict
The BGA variant of the i5-560M offers identical performance to its socketed counterpart but cannot be upgraded, making it relevant only for repair scenarios on existing hardware.
Overview
Launch
2010
Status
End-of-lifeGeneration
1st Gen Core i5 (Arrandale)
Market
Mobile
The Intel Core i5-560M in BGA 1288 packaging is a soldered dual-core Arrandale mobile processor with 2.67 GHz base and 3.2 GHz Turbo Boost, selected by OEMs for slim laptop designs where socketed CPUs were unnecessary.
The BGA 1288 version of the Core i5-560M delivers the same 2.667 GHz base clock and 3.2 GHz Turbo Boost as the Socket G1 variant but in a surface-mount package.
OEMs chose this form for thinner laptops where the additional Z-height of a PGA socket was undesirable. Part number SLBTT identifies this specific BGA variant.
Specifications
Performance
Same 5% improvement over the i5-540M, noticeable only in benchmarks.
VT-x and VT-d present but 2 cores severely constrain any meaningful virtualization.
Identical gaming capability to the Socket G1 variant. First-gen Intel HD Graphics remains the primary limitation.
35W TDP is identical across all Arrandale i5 SKUs. No efficiency advantage over lower-clocked variants.
- •Identical to socketed i5-560M in gaming performance
- •Integrated GPU is the bottleneck, not the CPU
- •Unplayable in any post-2012 game
- •No AI acceleration capabilities whatsoever
Architecture
32nm
Process Node
Arrandale
Codename
2C / 4T
Core Config
3 MB
L3 Cache
35 W
TDP
Architecture Overview
This BGA 1288 variant of the i5-560M is electrically and architecturally identical to the Socket G1 version. The only difference is the physical packaging: the mFCBGA10 package uses solder balls instead of pins, eliminating the socket mechanism. The 32nm Westmere CPU die and 45nm Ironlake GPU die remain the same, as do the 20x multiplier, 3MB L3 cache, and 16 PCIe 2.0 lanes.
CPU Design
Two 32nm Westmere cores with Hyper-Threading, 64KB L1 and 256KB L2 per core, 3MB shared L3. The 20.0x locked multiplier produces 2.667 GHz base.
Memory Subsystem
Dual-channel DDR3-800/1066 integrated memory controller with 8GB maximum capacity.
PCIe & I/O
16 PCIe 2.0 lanes from the CPU die for external devices.
Overclocking
No practical overclocking possible on BGA mobile platforms.
- 134 MHz higher base clock
- 127 MHz higher Turbo Boost
- Same 35W TDP envelope
- No architectural changes from i5-540M
Key Highlights
- Slightly higher clocks than i5-540M at same TDP
- AES-NI hardware acceleration
- VT-x and VT-d virtualization
- Mature 32nm process meant good binning quality
- BGA package requires professional rework to replace
- No upgrade path whatsoever
- Only 3MB L3 cache
- No AVX support
- 8GB RAM maximum
- Launched just months before Sandy Bridge made it obsolete
History
The BGA 1288 variant of the Core i5-560M served a specific market segment within the Arrandale ecosystem: OEMs building ultra-portable or cost-optimized laptops where the additional thickness and cost of a PGA socket were undesirable. Part number SLBTT was allocated specifically for this surface-mount version, and it was typically paired with HM55 chipsets in thinner laptop chassis.</br></br>What makes the BGA i5-560M particularly notable in hindsight is its timing.
Launching in September 2010, it had barely four months of relevance before Sandy Bridge's January 2011 debut fundamentally changed the mobile CPU landscape by integrating the GPU onto the same die as the CPU. The Arrandale dual-die approach—one 32nm CPU die and one 45nm GPU die—was an engineering compromise that Sandy Bridge immediately rendered obsolete. For the BGA i5-560M, this meant an exceptionally short effective product lifecycle, as OEMs rapidly transitioned their thin-and-light designs to the newer, more efficient Sandy Bridge platform.
Improvements over Previous Generation
- 134 MHz higher base clock
- 127 MHz higher Turbo Boost
- Same 35W TDP envelope
- No architectural changes from i5-540M
Alternatives & Competitors
Should You Buy It?
Not Recommended for the right buyer
Board-level repair of a specific Arrandale laptop that originally shipped with this exact BGA part
Avoid if…
- Any new system build or purchase
- Expecting upgradeability
- Running current software
- Any performance-sensitive workload
Use Cases
Interesting Facts
The BGA 1288 variant of the i5-560M carries only one part number (SLBTT), compared to two for the socketed version, suggesting more targeted OEM distribution.
The mFCBGA10 package designation refers to micro Flip Chip Ball Grid Array with approximately 1288 solder balls.
Despite being soldered, the BGA variant was sometimes more expensive than the socketed version due to lower production volumes and specialized packaging.
Some OEMs used the BGA i5-560M in laptops that had identical chassis designs to socketed versions, simply choosing BGA to reduce manufacturing cost and complexity.
The 133 MHz base clock (BCLK) was shared across all Arrandale processors, meaning all clock differences came solely from multiplier variations.
People Also Ask
What is the difference between BGA and Socket G1 i5-560M?
Performance is identical. The BGA version is soldered to the motherboard and cannot be upgraded, while the Socket G1 version uses a PGA socket allowing CPU replacement.
Can I replace a BGA i5-560M with a socketed one?
No. The motherboard PCB is designed for either BGA or PGA packaging. They are physically and electrically incompatible at the board level.
What laptops used the BGA i5-560M?
Various ultra-portable and business laptops from 2010-2011 where OEMs chose soldered CPUs for thinner designs. Exact models vary by region.
Is the BGA i5-560M faster than the socketed version?
No, they are electrically identical with the same 2.667 GHz base and 3.2 GHz Turbo Boost frequencies.
How do I know if my laptop has the BGA or socketed i5-560M?
Check the laptop service manual or look up the motherboard part number. Socket G1 systems typically mention CPU upgradeability in their documentation.
What is part number SLBTT?
SLBTT is the Intel sSpec number for the Core i5-560M in the BGA 1288 (mFCBGA10) package.
Can the BGA i5-560M be reballed and resoldered?
Technically yes with proper BGA rework equipment, but this requires professional skills and carries risk of board damage.
Does the BGA i5-560M run cooler than the socketed version?
Thermal performance is essentially identical since the silicon and TDP are the same. BGA may have slightly better thermal transfer due to direct solder contact.
What is the max memory for the BGA i5-560M?
8GB of DDR3-800 or DDR3-1066, same as all Arrandale processors.
Why did OEMs choose BGA over Socket G1 for the same CPU?
BGA reduces motherboard height, eliminates the socket cost, simplifies manufacturing, and prevents unauthorized CPU swaps that could cause warranty issues.
Frequently Asked Questions
What package does the BGA i5-560M use?
mFCBGA10, which is a micro Flip Chip Ball Grid Array with 1288 solder balls.
What is the TDP of the BGA i5-560M?
35 watts, identical to the socketed variant.
Does the BGA i5-560M support Hyper-Threading?
Yes, 2 cores with Hyper-Threading for 4 logical threads.
What is the cache size of the BGA i5-560M?
64KB L1 per core, 256KB L2 per core, 3MB shared L3.
What is the process node of the BGA i5-560M?
32nm for the CPU die, 45nm for the integrated GPU die.
Does the BGA i5-560M support PCIe 3.0?
No, it supports PCIe 2.0 with 16 lanes.
What integrated graphics does the BGA i5-560M have?
First-generation Intel HD Graphics on the 45nm GPU die, with 500 MHz base and 766 MHz turbo.
When was the BGA i5-560M released?
September 26, 2010, alongside the Socket G1 variant.
How many transistors does the BGA i5-560M have?
382 million on the CPU die and 177 million on the GPU die.
Can I upgrade from BGA i5-560M to a Sandy Bridge CPU?
No. Sandy Bridge uses completely different sockets (rPGA988B for socketed, different BGA for soldered) and is not physically compatible.